Texas Instruments selling OMAP division
Laying down their ARMs
Word has reached SemiAccurate that TI is hip-deep in the process of selling off their ARM/OMAP division. Updated August 19th, 2011
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Word has reached SemiAccurate that TI is hip-deep in the process of selling off their ARM/OMAP division. Updated August 19th, 2011
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Traditionally most of the embedded space has belonged to ARM, MIPS and the good old PowerPC, but Intel (NASDAQ:INTC) is starting to get more active in this space.
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It looks like a dark horse is going to be the one to watch for the next round of ARM CPUs, Marvell.
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Normally when you talk about ASIC’s (Application Specific Integrated Circuits), you always think of digital design, but now Triad Semiconductor Inc. has released a configurable ASIC that also includes analog blocks.
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SanDisk (NASDAQ:SNDK) has started shipping its Ultra SSD that is now available through online retailers such as Newegg.com.
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If 6Gbps SAS isn’t fast enough for your storage needs, LSI is coming to the rescue with SAS 12Gps silicon.
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AMD (NYSE:AMD) wants a larger part of the server market and the secret ingredient is called Bulldozer.
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Researchers from GE Global Research (NYSE:GE) have managed to squeeze 500GB of data onto a single DVD by using holographic storage.
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Bitspower is one of those niche manufacturers that puts out amazing quality parts, and gets very little credit.
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At CeBIT, Thecus went upmarket, and Computex saw more of the same.
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Lenovo (PINK:LNVGY) today announced its first family of tablets – the IdeaPad Tablet K1 for consumers, the ThinkPad Tablet for business customers, and the IdeaPad Tablet P1 for home and office use.
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The final piece of the TSMC 28nm HKMG process puzzle was put in place at SemiCon last week, it now makes sense.
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The RapidIO Trade Association has announced a technology roadmap of enhancements with the Serial RapidIO 10xN that supports single lane speeds of more than 10Gbps and device to device communication of more than 100Gbps, the association said in a press release.
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Samsung manages to rewrite resistive memory 1 trillion times and IMEC invents new filament to allow aggressive scaling.
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